Chinese mobile maker company Realme has now declared that it will be the first brand to launch a smartphone globally with the new processor integrated. Realme has taken to Twitter to announce that it will be the first brand to launch a Helio P70-integrated product globally. With MediaTek set to make the chipset available to clients in November, Realme is now expected to launch a device sometime next month itself.
The MediaTek Helio P70 is an octa-core SoC that’s been built on TSMC’s 12nm FinFET process, and it is meant to power “full-featured smartphones at affordable price points.” It bears four ARM Cortex-A73 cores clocked at up to 2.1GHz, and four ARM Cortex-A53 cores clocked at up to 2.0GHz.
These are arranged in a big.LITTLE configuration, while the SoC also features an ARM Mali-G72 MP3 GPU that’s clocked up to 900MHz. The Helio P70 SoC comes with a multi-core APU clocked at up to 525MHz for better edge-AI processing. It comes with a 4G LTE modem with up to 300Mbps peak download rates, and also supports dual 4G VoLTE. The SoC supports up to 32-megapixel single cameras, or 24+16-megapixel dual cameras.